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 The latest Wafer Bonder Tbon-100 from AST is equipped with advanced integrated contact pressure control, vacuum environment and separate heater design capable for independent multistage control vacuum hot embossing.?Applications include Group III-V Power Chip LED, MEMS and SOI production processes exceeding industry-standard in uniformity and yield rate.  Tbon-100 Wafer Bonder features include: (1) High throughput (2) High process quality reproducibility and stability (3) Full-automatic control interface (4) Modular design with minimum footprint |
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