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Advanced System Technology's latest
batch-rated plasma stripper, the Tsir-100, for mass production
not only incorporates an advanced ICP plasma generator design
to allow a low-energy plasma ashing capability, but its patented
response control design of a multiple branched plasma flow stream
further allows an ideal state of even cleanliness in all directions.
It has been acclaimed to be superior than the existing equipment
on the filed in terms of Uniformity and Yield Rate when adopted
in the fabrication processes for third generation Group-III-V
Lift-off, PR Stripping, Descum, Polymer cleaning. |
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Some of the Tsir-100 plasma stripper's
characteristics include,
(1) High batch-rated output of 50pcs * ¡í2¡¨wafers.
(2) High process quality recurrence and dependability.
(3) Fully automated operational control interface.
(4) Modulated design that requires very minimal space.
(5) More environmentally sound and free of waste liquid discharge
typical of the conventional wet production processes. |
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Wafer Numbers / Sizes |
(50 -25) pcs / (2"- 8") |
| RF Power |
300 ~1200 W (Option) |
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Gas Lines with MFCs |
3 Standard Lines |
| Base Pressure |
< 1E-2 Torr |
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Process Pressure Range |
From 10 to 1000 mTorr |
| Pumping System |
Rotary Vane Pump or
Dry pump (Option) |
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Automatic Control System |
Industrial HMI with Graphic User Interface |
| Power Requirement |
AC220V, 3 phase, 60
Hz, 40A, |
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Dry N2 Requirement |
1.2 kgw/cm2 |
| CDA Requirement |
5 kgw/cm2 |
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Water Requirement |
1.5
kgw/cm2, 20¢J, 5 l/min |
| Dimension (WxDxH)
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850 x 800 x 650 (mm) |
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Weight |
120 kgw |
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